7+ Sputtering Target Backing Plate

1-The Most Honest Reliable Supplier 2- Advanced Production Technique 3-40 Years Powder Metallurgy Engineers 4- Full Analysis Devices 5-724 Service 6-Optimum Quality with Low. Variety of traditional and custom alloy.

Kurt J Lesker Company Chromium Cr Sputtering Targets Enabling Technology For A Better World

Sputtering target stocking programs for quick turnaround on rebonded targets.

. For most sputtering RD guns the thickness of the target is reduced to half when it is bonded to a. We also offer complete bonding services to provide a complete solution. The metal target material that evaporates when sputtering is very hot so it cools and proceeds with the production process.

Consequently provided is a simple structure of sputtering targetbacking plate capable of sufficiently accommodating further high-power sputtering without deteriorating the. Arc-casting in inert gas argon means 100 density and minimal oxygen. The backing plate is used to cool the target material.

Sputtering Target Ti953Y47 wt approx 3x25w 4 copper backing plate Condition. Sputtering Target Backing Plates is composed of qualitative Indium ingot Tin ingot Pure water HCl NH3-H2O in appropriate quantities to ensure adherence to the set industrial standards. A sputtering target ie.

We are always thinking of ways to optimize your precious metal investment in the cost of your sputtering target. 100 target-backing plate alignment for proper fit of the cathode. The physical sputtering process Ch7 does not generate macros.

We offer backing plates in both standard configurations and custom dimensions to meet your specific requirements. HA is improved from 02. Preparing tantalum target and backing plateto add filler metal on the welding surface of backing platebrazing in a vacuum environment heating and the melting solder will be welded to.

Solid silicone rubber on the wafer backing plate so as to improve heat conduction from the wafer when the wafer is pushed on to it by a circumferential clamp. Silver Epoxy bonding is the lowest cost technique and involves bonding of the target to a backing plate using a specialized thermally and electrically conductive epoxy. US 30000 2708 for 12 months with PayPal Credit Buy It Now.

Bonding is the process to bond a sputtering target and a backing plate. To that end DHF targets can be manufactured with a custom backing. The typical material of.

At ACI Alloys Inc. Working at higher power the targets surface generates much. Sputtering Target Bonding NanoFoil a nanotechnology material is used to simplify the sputtering target bonding process in a process called NanoBonding.

In addition the backing plate enhances the mechanical strength. The sputtering targets are put into the sputtering source cathode inside the chamber sputtering deposition system. A material can transfer heat through its thickness faster when the material is thinner.

Since the purpose of a backing plate is to mount the target onto a sputtering machine and to release the. Sputtering targets are made from high-purity elemental metals. Most backing plate material requirements need high thermal and electrical conductivity tight geometrical tolerance to be non-corrosive and have good durability.

Self-sputtering is when a high energy atom or ion of the target material bombards a sputtering target and sputters the target. A planar target on which an erosion portion and a non-erosion portion are formed characterized in that one or a plurality of recesses are provided in the target. A backing plate is used to mechanically mount a sputtering target to the tool cooling device.

Pdf Monolithic Sputter Target Backing Plate With Integrated Cooling Passages Richard E Demaray Academia Edu